Nanometrics Combines IMPULSE+ Technology with 3D-NAND Interconnect Control

Nanometrics

Nanometrics Inc. (NASDAQ:NANO) is expanding its IMPULSE+ integrated metrology platform into 3D-NAND interconnect control. Combining IMPULSE+ with its NanoDiffract software, the program will now be able to support high-volume manufacturing across all steps of the 3D-NAND production.

“The IMPULSE+ supports the high throughput and precision needed for advanced interconnect applications,” said Nir Ben-Moshe, senior director of integrated metrology solutions at Nanometrics. “Our systems are qualified on the leading chemical mechanical polishing (CMP) systems, providing rapid feedback for advanced process control. After the memory cell and control periphery are completed, enabling high-performance, high-reliability processing of the interconnect circuits by measuring and controlling the metal damascene structures is key. The IMPULSE+ running NanoDiffract provides this control with advanced thin film and optical critical dimension (OCD) metrology.”

IMPULSE+ works with Nanometrics’ NanoDiffract software suite, for OCD modelling and control and as part of the IMPULSE, Trajectory T3, and Atlas systems.

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